| System Architecture | Chipset: GB10 Grace Blackwell Superchip; Combines a 20-core Arm CPU with a Blackwell GPU via NVLink-C2C interconnect; Coherent unified memory architecture. |
| CPU | 20-core Arm v9 processor (10× Cortex-X925 high-performance cores, 10× Cortex-A725 energy-efficient cores). |
| GPU | Blackwell architecture: 6,144 CUDA cores, 5th-gen Tensor Cores (1,000 AI TOPS FP4), 4th-gen RT Cores. |
| System Memory | 28GB LPDDR5X unified memory, 256-bit interface, 273GB/s bandwidth. Supports models up to 200B parameters. |
| Networking | ConnectX-7 Smart NIC (200Gbps RDMA for clustering); 10GbE RJ45; Wi-Fi 7 + Bluetooth 5.3. |
| Interfaces | 4× USB4 Type-C (40Gbps), 1× HDMI 2.1a (8K support). |
| Power Consumption | 170W typical; Up to 224W peak under heavy load. |
| Cooling | Passive airflow design optimized for silent operation. |
| Operating System | DGX OS (Ubuntu 22.04-based) with AI Enterprise software stack. |
| Model Capabilities | Inference up to 200B parameters; Fine-tuning up to 70B parameters; Scale to 405B with clustering. |
Security is integrated into every phase of the lifecycle, including factory-to-site integrity assurance. Silicon-based root of trust anchors end-to-end boot resilience.
Increase efficiency and accelerate operations with autonomous management solutions. Simplify, automate, and centralize management via advanced console control.
Designed with energy efficiency in mind, using recycled materials in products and packaging to help reduce carbon footprint and operation costs.
Designed for 24x7 enterprise data center operations, featuring enterprise-grade components and energy-efficient hardware optimized for deployment at scale.
Supports Secure Boot with Hardware Root of Trust technology, providing an extra layer of security and meeting NEBS Level 3 standards for modern data centers.





