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| Product Introduction | The MLU270F4 is one of the AI accelerator cards in the Siyuan 270 series launched by Cambricon Technology. It is designed for AI inference scenarios outside of data centers, features an active cooling solution, and is suitable for industrial environments, edge computing, and workstation deployment. |
| Name | MLU270F4 16GB |
| Benchmark Product | Comparable to T4 |
| INT8 | 256 TOPS |
| FP16 | 128 TOPS |
| FP32 | 24 TFLOPS |
| VRAM Type | HBM2E (High Bandwidth Memory, with approximately 30% higher bandwidth compared to HBM2, suitable for the high bandwidth demands of large model inference) |
| Chip Fabrication Process | TSMC 7nm FinFET process, paired with 2.5D CoWoS advanced packaging (ensuring core heat dissipation and signal stability) |
| DirectX Support | Compatible with DirectX 12 (including 12_1 features), suitable for mainstream graphics rendering and video processing scenarios |
| Video Memory Frequency | Effective frequency 3600MHz (native high-frequency characteristics of HBM2E, achieving low-latency data transfer with 800GB/s bandwidth) |
| Memory Bus Width | 2048-bit (HBM2E standard bus width design, providing sufficient data channels for 32GB VRAM to avoid bandwidth bottlenecks) |
| Video Memory Speed | 0.55 ns (based on the physical characteristics of HBM2E memory chips, corresponding to an equivalent frequency of 4000 MHz, with latency better than GDDR6) |
| Output Interface | No traditional video output interfaces (DP/HDMI/VGA), focused on data center inference/computing scenarios |
| Output Interface Type | The core interface is PCIe Gen4.0 x16 (bidirectional bandwidth 64GB/s), supporting x86/ARM host interconnection. |
| Form Factor | FHFL dual-slot |
| Weight | 1064g |
Designed for 24x7 enterprise data center operations, it features enterprise-grade components and energy-efficient hardware optimized for deployment at scale.
Supports Secure Boot with Hardware Root of Trust technology, provides an extra layer of security, and meets NEBS Level 3 standards to meet new data center standards.
The passively cooled, energy-efficient, dual-socket design fits a wide range of Tesla-Certified systems from OEM vendors and is easy to integrate into existing data center infrastructure.
