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| Product Introduction | The KunlunChip R200-8F 32GB is the third-generation cloud high-performance AI accelerator card. Built on the self-developed XPU-P architecture, it focuses on large-scale AI model training and inference scenarios, widely applied in finance, internet, and telecommunications. |
| Product Name | KunlunChip R200-8F 32GB |
| Benchmark Product | Comparable to A10 / T4 |
| Performance (FP16 / INT8) | 128 TFLOPS / 256 TOPS |
| Performance (FP32) | 32 TFLOPS |
| VRAM Type | GDDR6 (High Bandwidth Memory, approx. 30% higher bandwidth than standard GDDR6) |
| Fabrication Process | TSMC 7nm process with 2.5D CoWoS advanced packaging |
| Memory Bus Width | 1024-bit (Based on 1.2TB/s bandwidth) |
| Interface Type | PCIe Gen4.0 x16 (Bidirectional bandwidth 64GB/s) |
| Form Factor | FHFL dual-slot (Passive Cooling) |
| Weight | 1064g |
Silicon-based root of trust anchors end-to-end boot resilience. Multi-Factor Authentication (MFA) and role-based access controls ensure trusted operations.
Simplify, automate, and centralize management. Designed for 24x7 enterprise data center operations with energy-efficient hardware.
Innovative options for energy efficiency designed to help reduce the carbon footprint and lower operation costs.
Designed for large-scale infrastructure, supporting Secure Boot with Hardware Root of Trust technology. Meets NEBS Level 3 standards for new data center requirements. The passive cooling design fits a wide range of certified systems.