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| Product Introduction | The MLU270F4 is one of the AI accelerator cards in the Siyuan 270 series. It is designed for AI inference scenarios outside of data centers, features an active cooling solution, and is suitable for industrial environments, edge computing, and workstation deployment. |
| Name | MLU270F4 16GB |
| INT8 | 256 TOPS |
| FP16 | 96 TFLOPS |
| FP32 | 24 TFLOPS |
| VRAM Type | HBM2E (High Bandwidth Memory, with approximately 30% higher bandwidth compared to HBM2, suitable for high bandwidth demands of large model inference) |
| Chip Fabrication | TSMC 7nm FinFET process, paired with 2.5D CoWoS advanced packaging (ensuring core heat dissipation and signal stability) |
| DirectX Support | Compatible with DirectX 12 (including 12_1 features), suitable for mainstream graphics rendering and video processing scenarios |
| Memory Frequency | Effective frequency 3600MHz (native high-frequency characteristics of HBM2E, achieving low-latency data transfer with 800GB/s bandwidth) |
| Bus Width | 2048-bit (HBM2E standard bus width design, providing sufficient data channels for 32GB VRAM to avoid bandwidth bottlenecks) |
| Memory Speed | 0.55 ns (based on the physical characteristics of HBM2E memory chips, corresponding to an equivalent frequency of 4000 MHz, with latency better than GDDR6) |
| Interface | PCIe Gen4.0 x16 (bidirectional bandwidth 64GB/s), supporting x86/ARM host interconnection. No traditional video output interfaces (DP/HDMI/VGA). |
| Form Factor | FHFL dual-slot |
| Weight | 1064g |
Cyber Resilient Architecture
Security is integrated into every phase of the lifecycle, including protected supply chain and factory-to-site integrity assurance. Silicon-based root of trust anchors end-to-end boot resilience.
Autonomous Collaboration
Increase efficiency and accelerate operations with autonomous collaboration. Simplify, automate and centralize one-to-many management with advanced console integration.
Sustainability Focus
From recycled materials in products and packaging to innovative options for energy efficiency, designed to help reduce carbon footprint and lower operation costs.
Designed for 24x7 enterprise data center operations, it features enterprise-grade components and energy-efficient hardware optimized for deployment at scale.
Supports Secure Boot with Hardware Root of Trust technology, provides an extra layer of security, and meets NEBS Level 3 standards for modern data center requirements.
The passively cooled, energy-efficient, dual-socket design fits a wide range of systems from OEM vendors and is easy to integrate into existing data center infrastructure.
