Cost-Effective Kunlunxin R200-8F GPU Card High Efficiency for OEM/ODM AI Workstation Data Center Solutions

Product Description

KunlunChip R200-8F Front View
KunlunChip R200-8F Perspective View
Product Introduction: The KunlunChip R200-8F 32GB is the third-generation cloud high-performance AI accelerator card launched by Kunlun Chip Technology under Baidu. It is built on the self-developed XPU-P architecture, focusing on large-scale AI model training and inference scenarios. It has outstanding advantages in memory specifications, computing performance, and ecosystem compatibility, and has been widely applied to intelligent computing demand scenarios in key industries such as finance, internet, and telecommunications.
Name: KunlunChip R200-8F 32GB
Benchmark product: Comparable to A10/T4
FP16: 128 TFLOPS
INT8: 256 TOPS
FP32: 32 TFLOPS
VRAM type: GDDR6 (High Bandwidth Memory, with approximately 30% higher bandwidth compared to GDDR6, suitable for the high bandwidth demands of large model inference)
Chip fabrication process: TSMC 7nm process, paired with 2.5D CoWoS advanced packaging (ensuring core heat dissipation and signal stability)
DirectX support: Does not support DirectX or OpenGL for non-graphics rendering positioning, no game/graphics related API adaptation
Video memory frequency: Effective frequency 9.375Gbps By combining the HBM2 memory type with a 1.2TB/s bandwidth, the typical frequency of HBM2 memory in the same industry level is inferred.
Memory Bus Width: 1024bit Based on a memory bandwidth of 1.2TB/s and an HBM2 effective frequency of approximately 9.375Gbps (bandwidth = bus width × frequency ÷ 8), it complies with the HBM2 specification characteristics.
Video memory speed: 7ns (based on the physical characteristics of HBM2E memory chips, corresponding to an equivalent frequency of 4000 MHz, with latency better than GDDR6)
Output Interface: No traditional video output interfaces (DP/HDMI/VGA), focused on data center inference/computing scenarios
Output interface type: The core interface is PCIe Gen4.0 x16 (bidirectional bandwidth 64GB/s), supporting x86/ARM host interconnection.
Form Factor: FHFL dual - slot
Weight: 1064g
Cyber Resilient Architecture Image

KunlunChip R200-8F 32GB

Cyber Resilient Architecture for Zero Trust IT environment & operations

Security is integrated into every phase of the PowerEdge lifecycle, including protected supply chain and factory-to-site integrity assurance. Silicon-based root of trust anchors end-to-end boot resilience while Multi-Factor Authentication (MFA) and role-based access controls ensure trusted operations.

Autonomous Collaboration Image

KunlunChip R200-8F 32GB

Increase efficiency and accelerate operations with autonomous collaboration

The OpenManage™ systems management portfolio delivers a secure, efficient, and comprehensive solution for PowerEdge servers. Simplify, automate and centralize one-to-many management with the OpenManage Enterprise console and iDRAC.

Sustainability Image

KunlunChip R200-8F 32GB

Sustainability

From recycled materials in our products and packaging, to thoughtful, innovative options for energy efficiency, the PowerEdge portfolio is designed to make, deliver, and recycle products to help reduce the carbon footprint and lower your operation costs. We even make it easy to retire legacy systems responsibly with Technologies Services.

KunlunChip Hardware Detail

KunlunChip R200-8F 32GB

Designed for 24x7 enterprise data center operations, it features enterprise-grade components and energy-efficient hardware optimized for deployment at scale.

Supports Secure Boot with Hardware Root of Trust technology, provides an extra layer of security, and meets NEBS Level 3 standards to meet new data center standards.

The passively cooled, energy-efficient, dual-socket design fits a wide range of Tesla-Certified systems from OEM vendors and is easy to integrate into existing data center infrastructure.

Hardware Architecture Diagram 1
Hardware Architecture Diagram 2
Infrastructure Highlight 1
Infrastructure Highlight 2
Infrastructure Highlight 3
Infrastructure Highlight 4
Infrastructure Highlight 5
Infrastructure Highlight 6
Frequently Asked Questions
🔷 Q1: What product solutions can you purchase?
We offer a wide range of hardware solutions, including Server, Storage, Workstations, Memory, Hard Disk, laptop, and Desktop systems.
🔷 Q2: Do you support product customization with an R&D team?
Yes, we have our own R&D team and can customize products according to your specific requirements.
🔷 Q3: How is product quality ensured?
We maintain high quality standards with a dedicated team of professional engineers and a strict QA and QC system.
🔷 Q4: What is the packaging process for shipments?
Products are typically packed in standard cartons. However, packaging can also be tailored according to your specific requirements.
🔷 Q5: What is the estimated delivery timeframe?
Delivery time depends on the quantity needed, but typically takes around 7 days.

Related Products