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| Product Introduction | The KunlunChip R200-8F 32GB is the third-generation cloud high-performance AI accelerator card launched by Kunlun Chip Technology under Baidu. It is built on the self-developed XPU-P architecture, focusing on large-scale AI model training and inference scenarios. It has outstanding advantages in memory specifications, computing performance, and ecosystem compatibility, and has been widely applied to intelligent computing demand scenarios in key industries such as finance, internet, and telecommunications. |
| Name | KunlunChip R200-8F 32GB |
| Benchmark product | Comparable to A10/T4 |
| FP16 | 128 TFLOPS |
| INT8 | 256 TOPS |
| FP32 | 32 TFLOPS |
| VRAM type | GDDR6 (High Bandwidth Memory, with approximately 30% higher bandwidth compared to GDDR6, suitable for the high bandwidth demands of large model inference) |
| Chip fabrication process | TSMC 7nm process, paired with 2.5D CoWoS advanced packaging (ensuring core heat dissipation and signal stability) |
| DirectX support | Does not support DirectX or OpenGL for non-graphics rendering positioning, no game/graphics related API adaptation |
| Video memory frequency | Effective frequency 9.375Gbps. By combining the HBM2 memory type with a 1.2TB/s bandwidth, the typical frequency of HBM2 memory in the same industry level is inferred. |
| Memory Bus Width | 1024bit Based on a memory bandwidth of 1.2TB/s and an HBM2 effective frequency of approximately 9.375Gbps (bandwidth = bus width × frequency ÷ 8), it complies with the HBM2 specification characteristics. |
| Video memory speed | 7ns (based on the physical characteristics of HBM2E memory chips, corresponding to an equivalent frequency of 4000 MHz, with latency better than GDDR6) |
| Output Interface | No traditional video output interfaces (DP/HDMI/VGA), focused on data center inference/computing scenarios |
| Output interface type | The core interface is PCIe Gen4.0 x16 (bidirectional bandwidth 64GB/s), supporting x86/ARM host interconnection. |
| Form Factor | FHFL dual-slot |
| Weight | 1064g |
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Designed for 24x7 enterprise data center operations, it features enterprise-grade components and energy-efficient hardware optimized for deployment at scale.
Supports Secure Boot with Hardware Root of Trust technology, provides an extra layer of security, and meets NEBS Level 3 standards to meet new data center standards.
The passively cooled, energy-efficient, dual-socket design fits a wide range of Tesla-Certified systems from OEM vendors and is easy to integrate into existing data center infrastructure.
What are the primary target applications for the KunlunChip R200-8F 32GB?
The KunlunChip R200-8F 32GB is specifically optimized for large-scale AI model training and inference workloads. It is widely adopted across high-demand computational industries including telecommunications, finance, and internet services.
How does the memory subsystem on the KunlunChip R200-8F perform compared to standard GDDR6?
The accelerator incorporates high-bandwidth HBM2 memory with a 1024-bit bus width. This configuration provides up to 1.2TB/s memory bandwidth, representing an approximate 30% bandwidth increase over standard GDDR6 configurations, making it excellent for processing large language models.
Does the KunlunChip R200-8F 32GB support graphic APIs like DirectX or OpenGL?
No. This card is purely designed for data center computing and high-performance AI inference. It does not carry traditional graphic APIs adaptation such as DirectX or OpenGL, and lacks display output ports (HDMI/DP).
What fabrication technology is used for this accelerator card?
It is built using TSMC's advanced 7nm fabrication process and combined with 2.5D CoWoS advanced packaging, which guarantees exceptional thermal dissipation efficiency and signal stability under intense computing operations.
What host interface and form factor does the card use?
It features a standard PCIe Gen4.0 x16 interface providing 64GB/s bidirectional bandwidth and operates with a FHFL (Full-Height Full-Length) dual-slot passive cooling design compatible with various OEM system layouts.
Is the KunlunChip R200-8F suitable for continuous 24x7 enterprise environments?
Yes, it is designed with enterprise-grade components, features Hardware Root of Trust technology for secure booting, and complies with NEBS Level 3 standards to meet modern data center specifications.
