Versatile Kunlunxin R200-8F AI Computing Card Optimized for Deep Learning Video Analysis Smart City Applications

Product Description

KunlunChip R200-8F 32GB Performance Header
KunlunChip R200-8F 32GB Architecture View
Product Introduction The KunlunChip R200-8F 32GB is the third-generation cloud high-performance AI accelerator card launched by Kunlun Chip Technology under Baidu. It is built on the self-developed XPU-P architecture, focusing on large-scale AI model training and inference scenarios. It has outstanding advantages in memory specifications, computing performance, and ecosystem compatibility, and has been widely applied to intelligent computing demand scenarios in key industries such as finance, internet, and telecommunications.
Name KunlunChip R200-8F 32GB
Benchmark product Comparable to A10/T4
FP16 128 TFLOPS
INT8 256 TOPS
FP32 32 TFLOPS
VRAM type GDDR6 (High Bandwidth Memory, with approximately 30% higher bandwidth compared to GDDR6, suitable for the high bandwidth demands of large model inference)
Chip fabrication process TSMC 7nm process, paired with 2.5D CoWoS advanced packaging (ensuring core heat dissipation and signal stability)
DirectX support Does not support DirectX or OpenGL for non-graphics rendering positioning, no game/graphics related API adaptation
Video memory frequency Effective frequency 9.375Gbps. By combining the HBM2 memory type with a 1.2TB/s bandwidth, the typical frequency of HBM2 memory in the same industry level is inferred.
Memory Bus Width 1024bit. Based on a memory bandwidth of 1.2TB/s and an HBM2 effective frequency of approximately 9.375Gbps (bandwidth = bus width × frequency ÷ 8), it complies with the HBM2 specification characteristics.
Video memory speed 7ns (based on the physical characteristics of HBM2E memory chips, corresponding to an equivalent frequency of 4000 MHz, with latency better than GDDR6)
Output Interface No traditional video output interfaces (DP/HDMI/VGA), focused on data center inference/computing scenarios
Output interface type The core interface is PCIe Gen4.0 x16 (bidirectional bandwidth 64GB/s), supporting x86/ARM host interconnection.
Form Factor FHFL dual-slot
Weight 1064g
Cyber Resilient Architecture

Cyber Resilient Architecture for Zero Trust IT environment & operations

Security is integrated into every phase of the PowerEdge lifecycle, including protected supply chain and factory-to-site integrity assurance. Silicon-based root of trust anchors end-to-end boot resilience while Multi-Factor Authentication (MFA) and role-based access controls ensure trusted operations.

Autonomous Collaboration

Increase efficiency and accelerate operations with autonomous collaboration

The OpenManage™ systems management portfolio delivers a secure, efficient, and comprehensive solution for PowerEdge servers. Simplify, automate and centralize one-to-many management with the OpenManage Enterprise console and iDRAC.

Sustainability

Sustainability

From recycled materials in our products and packaging, to thoughtful, innovative options for energy efficiency, the PowerEdge portfolio is designed to make, deliver, and recycle products to help reduce the carbon footprint and lower your operation costs. We even make it easy to retire legacy systems responsibly with Technologies Services.

KunlunChip R200-8F 32GB Deployment
Enterprise Grade

KunlunChip R200-8F 32GB

Designed for 24x7 enterprise data center operations, it features enterprise-grade components and energy-efficient hardware optimized for deployment at scale.

Supports Secure Boot with Hardware Root of Trust technology, provides an extra layer of security, and meets NEBS Level 3 standards to meet new data center standards.

The passively cooled, energy-efficient, dual-socket design fits a wide range of Tesla-Certified systems from OEM vendors and is easy to integrate into existing data center infrastructure.

Detailed Diagram Component 1
Detailed Diagram Component 2
Installation Overview
Architecture Chart
Data Flow Map
Processor Close-up
Performance Graph
Board Dimension View
Frequently Asked Questions
Q What equipment can be purchased from your product range?
Our product lines cover Server platforms, Storage devices, Workstations, Memory components, Hard Disks, laptops, and Desktops.
Q Is custom manufacturing or product specification modification supported?
Yes, custom modifications and product adaptations can be accommodated based on specific customer requirements.
Q How is the build quality of these high-performance components guaranteed?
Products are verified and monitored through rigorous engineering QA and QC testing workflows to maintain optimal standards before deployment.
Q What are the standard packaging options for safe transit?
Products are normally shipped in secure cartons. Custom packaging options are available upon request to fit specific shipping requirements.
Q What is the standard delivery timeframe for orders?
The standard delivery timeframe is typically around 7 days, depending on the volume and specifications of the ordered quantity.

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