Cutting-edge China Made Kunlunxin R200-8F GDDR6 32GB for High-Speed Large Model Inference Server Card

Product Description

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Product Introduction The KunlunChip R200-8F 32GB is the third-generation cloud high-performance AI accelerator card launched by Kunlun Chip Technology. Built on the self-developed XPU-P architecture, it focuses on large-scale AI model training and inference. It offers outstanding memory specifications, computing performance, and ecosystem compatibility for finance, internet, and telecommunications.
Model Name KunlunChip R200-8F 32GB
Benchmark Product Comparable to A10 / T4
FP16 Performance 128 TFLOPS
INT8 Performance 256 TOPS
FP32 Performance 32 TFLOPS
VRAM Type GDDR6 (High Bandwidth Memory, with approximately 30% higher bandwidth compared to standard GDDR6, optimized for large model inference)
Fabrication Process TSMC 7nm process, 2.5D CoWoS advanced packaging for superior heat dissipation and signal stability.
Memory Bus Width 1024-bit (Based on 1.2TB/s bandwidth and HBM2 specification characteristics)
Memory Speed 7ns (HBM2E memory chips, equivalent frequency 4000 MHz, lower latency than GDDR6)
Interface Type PCIe Gen4.0 x16 (64GB/s bidirectional bandwidth), supporting x86/ARM host interconnection.
Form Factor FHFL dual-slot
Weight 1064g

Zero Trust Architecture

Security is integrated into every phase of the lifecycle, including protected supply chain and factory-to-site integrity assurance. Silicon-based root of trust anchors end-to-end boot resilience.

Autonomous Collaboration

Increase efficiency and accelerate operations with a secure, efficient, and comprehensive management solution. Simplify and centralize one-to-many management through enterprise consoles.

Sustainability

Designed with energy-efficient hardware to reduce carbon footprints and lower operation costs. Innovative options for energy efficiency help manage large-scale deployments responsibly.

Enterprise Data Center Ready

Designed for 24x7 enterprise data center operations, featuring enterprise-grade components optimized for scale. Supports Secure Boot with Hardware Root of Trust and meets NEBS Level 3 standards.

The passively cooled, energy-efficient dual-slot design fits a wide range of certified systems and is easy to integrate into existing infrastructure.

Frequently Asked Questions

What are the primary applications for the KunlunChip R200-8F?
The KunlunChip R200-8F is specifically designed for high-performance AI tasks, including large-scale model training and inference in sectors like finance, telecommunications, and internet services.
Is the R200-8F compatible with standard server architectures?
Yes, it utilizes a standard PCIe Gen4.0 x16 interface and is compatible with both x86 and ARM-based host systems, making it easy to integrate into existing data center infrastructures.
Does this AI accelerator support traditional video output?
No, the KunlunChip R200-8F is a pure computing accelerator designed for data centers. It does not include DP, HDMI, or VGA ports as it is optimized for non-graphics computational tasks.
How does the memory performance compare to standard GPUs?
The R200-8F features GDDR6/HBM2 class memory with a 1024-bit bus width and 1.2TB/s bandwidth, which is approximately 30% higher than standard GDDR6, ideal for massive AI data throughput.
What cooling solution is required for this card?
The card features a passive cooling design, which relies on the airflow within enterprise servers. This ensures energy efficiency and high reliability for 24x7 operations.
What security features are included for enterprise use?
It supports Secure Boot with Hardware Root of Trust and is designed with a Cyber Resilient Architecture, ensuring a Zero Trust IT environment for sensitive data processing.

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