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| Product Introduction | The Kunlun Chip R200-8F 16GB is the third-generation cloud high-performance AI accelerator card launched by Kunlun Chip Technology under Baidu. It is built on the self-developed XPU-P architecture, focusing on large-scale AI model training and inference scenarios. It has outstanding advantages in memory specifications, computing performance, and ecosystem compatibility. |
| Model Name | Kunlun Chip P200-8F 16GB |
| Computing Performance (INT8) | 256 TOPS |
| VRAM Type | HBM2E (High Bandwidth Memory, with approximately 30% higher bandwidth compared to HBM2) |
| Fabrication Process | TSMC 7nm process, paired with 2.5D CoWoS advanced packaging |
| Video Memory Bandwidth | 1.2TB/s effective frequency 9.375Gbps |
| Memory Bus Width | 1024bit |
| Output Interface | None (Focused on data center inference/computing); PCIe Gen4.0 x16 core interface |
| Form Factor | FHFL dual-slot |
| Weight | 1064g |
Security is integrated into every phase of the lifecycle. Silicon-based root of trust anchors end-to-end boot resilience while Multi-Factor Authentication (MFA) and role-based access controls ensure trusted operations.
Increase efficiency and accelerate operations with comprehensive management solutions. Simplify, automate and centralize one-to-many management with advanced enterprise consoles.
Designed for energy efficiency to help reduce the carbon footprint and lower operation costs. The portfolio uses recycled materials and innovative energy-saving options.
Designed for 24x7 enterprise data center operations, the Kunlun Chip R200-8F features enterprise-grade components optimized for deployment at scale. It supports Secure Boot with Hardware Root of Trust technology and meets NEBS Level 3 standards. The passively cooled, energy-efficient design fits a wide range of certified systems from major OEM vendors.
