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| Product Name | xi Si N260 (MXN260) 64GB |
| Performance Standard | Comparable to L20 |
| FP32 Performance | 15 TFLOPS |
| FP16 Performance | 80 TFLOPS |
| INT8 Performance | 160 TOPS |
| Memory Specifications | HBM2E (High Bandwidth Memory, with approximately 30% higher bandwidth compared to HBM2, suitable for the high bandwidth demands of large model inference) |
| Manufacturing Process | TSMC 7nm FinFET process, paired with 2.5D CoWoS advanced packaging (ensuring core heat dissipation and signal stability) |
| API Constraints | Does not support DirectX or OpenGL for non-graphics rendering positioning, no game/graphics related API adaptation |
| Effective Frequency | Effective frequency 9.375Gbps. By combining the HBM2 memory type with a 1.2TB/s bandwidth, the typical frequency of HBM2 memory in the same industry level is inferred. |
| Memory Bus Width | 1024bit. Based on a memory bandwidth of 1.2TB/s and an HBM2 effective frequency of approximately 9.375Gbps (bandwidth = bus width × frequency ÷ 8), it complies with the HBM2 specification characteristics. |
| Memory Latency | ~7ns (based on the physical characteristics of HBM2E memory chips, corresponding to an equivalent frequency of 4000 MHz, with latency better than GDDR6) |
| Video Output | No traditional video output interfaces (DP/HDMI/VGA), focused on data center inference/computing scenarios |
| Bus Interface | The core interface is PCIe Gen4.0 x16 (bidirectional bandwidth 64GB/s), supporting x86/ARM host interconnection. |
| Form Factor | FHFL dual-slot |
| Product Weight | 1064g |
