| Product Name | KunlunChip R200-8F 32GB |
| Benchmark | Comparable to A10/T4 |
| FP16 Performance | 128 TFLOPS |
| INT8 Performance | 256 TOPS |
| FP32 Performance | 32 TFLOPS |
| VRAM Type | GDDR6 (HBM2 high bandwidth version, approx. 30% higher bandwidth than standard GDDR6) |
| Process Technology | TSMC 7nm with 2.5D CoWoS advanced packaging |
| Bus Interface | PCIe Gen4.0 x16 (64GB/s bidirectional bandwidth) |
| Memory Bandwidth | 1.2TB/s |
| Bus Width | 1024bit |
| Form Factor | FHFL dual-slot |
| Weight | 1064g |
Security is integrated into every phase of the lifecycle, including protected supply chain and silicon-based root of trust anchors for end-to-end boot resilience.
Increase efficiency and accelerate operations with comprehensive system management solutions that simplify, automate, and centralize management.
Designed for energy efficiency and reduced carbon footprint, using recycled materials and innovative energy-saving options to lower operation costs.
Designed for 24x7 enterprise data center operations, featuring hardware optimized for deployment at scale. It meets NEBS Level 3 standards and supports Secure Boot with Hardware Root of Trust technology.
The passively cooled, dual-socket design fits a wide range of certified systems and is easy to integrate into existing data center infrastructure.







